William Le
Packaging Engineer
William Le has been a Packaging Engineer for Ameripack since February 2020. He graduated in 2019 from the University of Wisconsin – Stout with Bachelor’s degrees in Packaging and Business Administration, along with a minor in Project Management.
During his college career, he worked as an intern for Hewlett Packard Enterprise in Chippewa Falls, WI and Ensign-Bickford Aerospace and Defense Company in Simsbury, CT. William enjoys playing music, voice acting and watching movies. He also enjoys spending time outside camping, hiking, and playing tennis.
